Physical Failure Analysis TEM Engineer / Scientist
Job Description
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
onsemi is seeking a self-driven, hands-on, engineer / scientist to join their Product Analysis Lab, located in Phoenix, AZ. As a Physical Failure Analysis (PFA) Engineer, you will have the opportunity to utilize leading edge tools and techniques to prepare and image physical defects causing electrical failure in a wide variety of onsemi products with focus on image sensors and power modules. The Product Analysis Lab in Phoenix is focused on providing best-in-class analytical support for the Company, not only in completing high quality Failure Analysis (FA) work but also in driving technological advancements and efficiency gains in the FA process through method development and innovation.
The successful candidate will have the opportunity to:
- Perform PFA of onsemi integrated circuits - external customer returns, internal qualifications/evaluations failures, and design debug. The portfolio includes a wide variety of ICs including complex image sensors, smart discrete power modules, analog, and mixed-signal devices. Visit www.onsemi.com for a complete listing of all products
- The PFA engineer will be primarily responsible for analytical TEM imaging and sample preparation
- They will also operate multiple SEM and FIB tools often using CAD software to drive to areas of interest
- FIB work will include TEM liftout sample prep, FIB circuit edits (probe pads, jumpers, isolating circuits), and progressive cross-sections
- SEM work may include various imaging techniques including SE / BSE and EDS x-ray microanalysis of semiconductor and metallurgical structures. Imaging of electrically active defects using passive voltage contrast, and EBIC / EBAC using nanoprobing may also be required. AFM scanning capacitance microscopy is also an area for development
- Development of methods for delayering integrated circuits using mechanical, chemical / plasma etching, FIB, and laser methods could be pursued
- This position requires an innovative approach to problem solving through sample preparation and use of various analytical tools. Method development is a key component of this position
MS / PhD in Physics, Materials Science, Metallurgy, or Electrical or Mechanical Engineering
- 2+ yrs related experience using analytical TEM for analysis of materials defects preferably in semiconductor devices
- New college graduates will be considered provided they have had hands-on TEM experience
Preferred:
- A strong interdisciplinary interest in physics, chemistry, and multiple engineering disciplines is a strong attribute
- Other skills of value include:
o Familiarity with laser modification / milling of materials
o Basic understanding of fractography and stress modeling
o Metallurgical understanding of soft metals such as solders, gold, copper, and aluminum particularly in terms of fatigue and corrosion characteristics
o Computer skills in image analysis using ImageJ, MatLab, etc
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If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact US.HR@onsemi.com for assistance.